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Elimination of oxynitride (ONO) etch residue and polysilicon str

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
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Elimination of pad glazing for Al CMP

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Elimination of photo-induced electrochemical dissolution in...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Elimination of resist footing on tera hardmask

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Elimination/reduction of black silicon in DT etch

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Embedded thermal conductors for semiconductor chips

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
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Embossed mask lithography

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
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Employing an acidic liquid and an abrasive surface to polish...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Employing deionized water and an abrasive surface to polish a se

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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End point detection method for forming a patterned silicon...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
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End point determination of process residues in wafer-less...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Endpoint control for small open area by RF source parameter Vdc

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Endpoint detection by chemical reaction and photoionization

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Endpoint detection for high density plasma (HDP) processes

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Endpoint detection in chemical-mechanical polishing of...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Endpoint detection in the etching of dielectric layers

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Endpoint detection method and apparatus

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Endpoint detection method and apparatus which utilize a chelatin

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Endpoint detection method and apparatus which utilize an endpoin

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Endpoint detector for a chemical mechanical polishing system

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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