Embossed mask lithography

Details Embossed mask lithography Embossed mask lithography

2005-05-03

2005-05-03

Smith, Matthew (Department: 2825)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C438S600000, C438S577000, C438S800000, C438S598000, C438S668000, C438S942000, C427S133000, C430S311000, C430S322000

Reexamination Certificate

active

06887792

ABSTRACT:
Disclosed are layered groupings and methods for constructing digital circuitry, such as memory known as Permanent Inexpensive Rugged Memory (PIRM) cross point arrays which can be produced on flexible substrates by patterning and curing through the use of a transparent embossing tool.

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Xiao-Mei Zhao et al; Fabrication of Three-Dimensional Micro-Structures;Microtransfer Molding; Oct. 1, 1996; vol. 8, No. 10; ISSN; 0935-9648 XP000626312.

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