Endpoint detector for a chemical mechanical polishing system

Details Endpoint detector for a chemical mechanical polishing system Endpoint detector for a chemical mechanical polishing system

1996-10-03

1998-12-08

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438 14, 156345, 216 84, 216 88, H01L 2100

Patent

active

058468820

ABSTRACT:
An endpoint detector for a substrate polishing apparatus integrates a signal indicative of the instantaneous material removal rate from the substrate. The signal is generated by a monitor which measures a motor parameter such as torque or current draw. The resulting sum is compared to a baseline sum known to yield the desired polishing to predict the polishing endpoint.

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