Embedded thermal conductors for semiconductor chips

Details Embedded thermal conductors for semiconductor chips Embedded thermal conductors for semiconductor chips

1999-04-22

2000-08-08

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

438700, 438758, H01L 2100

Patent

active

061001996

ABSTRACT:
A semiconductor chip structure includes a substrate, at least one thermal conductor embedded within the semiconductor chip structure, the thermal conductor providing electrical insulation and a plurality of devices formed within the structure adjacent to the at least one thermal conductor such that during operation heat produced in the devices is transferred into and through the at least one thermal conductor to reduce an operating temperature of the devices. This structure is particularly useful in silicon-on insulator devices. A method of forming embedded thermal conductors in a semiconductor chip includes the steps of providing a substrate having an oxide layer formed thereon, etching trenches into the oxide layer, depositing diamond to fill the trenches to form thermal conductors contacting the substrate and forming devices and contacts adjacent to the thermal conductors for providing heat flow paths to reduce an operating temperature of the devices.

REFERENCES:
patent: 4935864 (1990-06-01), Schmidt et al.
patent: 5371407 (1994-12-01), Goldman
patent: 5391914 (1995-02-01), Sullivan et al.
patent: 5455448 (1995-10-01), Benjamin
patent: 5621616 (1997-04-01), Owens et al.
Edholm et al., "Silicon-on-Diamond MOS-Transistors with Thermally Grown Gate Oxide", IEEE, International Conference, Oct. 1997, pp. 30-31.

Affiliated with

Also associated with

Rating

Embedded thermal conductors for semiconductor chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Embedded thermal conductors for semiconductor chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Embedded thermal conductors for semiconductor chips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1150020