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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip package structure and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip package structure and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip package structure and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Chip package structure and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip package structure and process for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
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Chip package structure having π filter

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip package structure with dual heat sinks

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip package structure with glass substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip package substrate having soft circuit board and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
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Chip package with a ring having a buffer groove that...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
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Chip package with capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Chip package with degassing holes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With means to prevent explosion of package
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Chip package with die and substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Chip package with die and substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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