Chip package structure with glass substrate

Details Chip package structure with glass substrate Chip package structure with glass substrate

2006-05-02

2006-05-02

Smith, Bradley K. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S690000, C257S737000

Reexamination Certificate

active

07038309

ABSTRACT:
The present invention provides a chip package structure, comprising: a glass substrate having a substrate surface; a circuit layer on the substrate surface, wherein the circuit layer comprises an interconnection structure; at least a die on the circuit layer, wherein the die is coupled to the interconnection structure; and a plurality of contacts on the circuit layer, wherein the contacts are coupled to the interconnection structure.

REFERENCES:
patent: 2002/0033189 (2002-03-01), Macris
patent: 2003/0201521 (2003-10-01), Tsai et al.

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