Chip package structure and manufacturing method thereof

Details Chip package structure and manufacturing method thereof Chip package structure and manufacturing method thereof

2011-08-23

2011-08-23

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000

Reexamination Certificate

active

08004079

ABSTRACT:
A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.

REFERENCES:
patent: 4739448 (1988-04-01), Rowe et al.
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5583377 (1996-12-01), Higgins, III
patent: 6265771 (2001-07-01), Ference et al.
patent: 6716676 (2004-04-01), Chen et al.
patent: 7683469 (2010-03-01), Oh et al.
patent: 7781882 (2010-08-01), Zhong et al.
patent: 2002/0084524 (2002-07-01), Roh et al.
patent: 2010/0224978 (2010-09-01), Shim et al.
patent: 2011/0001230 (2011-01-01), Li et al.

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