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C4 package die backside coating

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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C4 substrate contact pad which has a layer of Ni-B plating

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Cap wafer, semiconductor chip having the same, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Capacitance type semiconductor sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Capacitance type semiconductor sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Capacitive coupling configuration for an intergrated circuit pac

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Capacitor and semiconductor device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Capacitor embedded in interposer, semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Capacitor-built-in type printed wiring substrate, printed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Capacitor-built-in type printed wiring substrate, printed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Capacitors having separate terminals on three or more sides

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Capcitively coupled bi-directional data and power transmission s

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent

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Capillary underflow integral heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Capsule for at least one high power transistor chip for high...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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Carbon dioxide gettering for a chip module assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling
Reexamination Certificate

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Carbon nanotube-based structures and methods for removing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Carbon-carbon and/or metal-carbon fiber composite heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Carbonaceous composite heat spreader and associated methods

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Card like semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent

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Card manufacturing technique and resulting card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

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