Chip package with a ring having a buffer groove that...

Details Chip package with a ring having a buffer groove that... Chip package with a ring having a buffer groove that...

2006-12-21

2009-06-16

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S784000, C257S787000, C438S116000

Reexamination Certificate

active

07547962

ABSTRACT:
A chip package including a package substrate, a chip, several bonding wires, a flash-resisting ring and a molding compound. The package substrate includes a carrying surface and several contacts disposed on the carrying surface. The chip is disposed on the carrying surface. A surface of the chip away from the package substrate includes an active region and several bonding pads. The bonding pads are located outside the active region. The bonding wires connect the bonding pads and the contacts. The flash-resisting ring disposed on the chip is located between the bonding pads and the active region. The flash-resisting ring surrounding the active region includes at least one buffer groove. The buffer groove surrounds the active region. The molding compound disposed on the package substrate and the chip encapsulates at least the bonding pads, the contacts and the bonding wires. The molding compound exposes the active region.

REFERENCES:
patent: 6401545 (2002-06-01), Monk et al.
patent: 6838760 (2005-01-01), Cobbley
patent: 6987312 (2006-01-01), Theuss
patent: 7187067 (2007-03-01), Weng et al.
patent: 2006/0087017 (2006-04-01), Chao et al.
patent: 2001185657 (2001-07-01), None

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