LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

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Wafer assembly comprising MEMS wafer with polymerized...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Reexamination Certificate

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Wafer bonding hermetic encapsulation

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials

Reexamination Certificate

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Wafer bonding of micro-electro mechanical systems to active...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Wafer bonding using reactive foils for massively parallel...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

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Wafer integrated with permanent carrier and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Wafer level assembly package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

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Wafer level chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

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Wafer level chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Wafer level chip scale package (WLCSP) with high reliability...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Wafer level chip scale packaging structure and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level chip size package having redistribution layers

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level chip size package having rerouting layers

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level chip size packaged chip device with a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level chip size packaged chip device with an N-shape...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Wafer level chip size packaged chip device with an N-shape...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level device package with sealing line having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level hermetic bond using metal alloy with raised feature

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level incapsulation chip and encapsulation chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Reexamination Certificate

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Wafer level package configured to compensate size difference...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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