LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Gel thermal interface materials comprising fillers having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling

Gettering enclosure for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...

Glass board used in the production of liquid crystal panels

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Glass cap molding package, manufacturing method thereof and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Glass for window of semiconductor package, glass window for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Glass lid, and package provided with such a lid, for the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Glueless integrated circuit system in a packaging module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Graded liquid crystal polymer package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Graphite composite heat pipe

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Grid array device package including advanced heat transfer mecha

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Grid array package with reduced power and ground impedance...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Grooved semiconductor die for flip-chip heat sink attachment

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ground arch for wirebond ball grid arrays

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Ground plane for integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Grounding of package substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Group III nitride based flip-chip integrated circuit and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Group III nitride based flip-chip intergrated circuit and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Gull-wing zig-zag inline lead package having end-of-package anch