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Hard mask for copper plasma etch

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
Reexamination Certificate

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Header for electronic components board in surface mount and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Heat conductive plate structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat conductive silicone composition and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Heat conductive substrate press-mounted in PC board hole for tra

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Heat conductivity and brightness enhancing structure for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Heat dissipating device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Heat dissipating device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Heat dissipating microelectronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat dissipating package structure and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat dissipation apparatus for package device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat dissipation assembly and method for producing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat dissipation device having a load centering mechanism

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat dissipation for chip-on-chip IC packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat dissipation for heat generating element of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Heat dissipation in integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat dissipation plate and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Heat dissipation structure for electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat dissipation structure for electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat dissipation structure of an electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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