4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
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3-D ICs with microfluidic interconnects and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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3-D integrated semiconductor device comprising intermediate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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3-D packaging using massive fillo-leaf technology

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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3-D stackable semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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3D interconnect with protruding contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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3D smart power module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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