Chip package substrate having soft circuit board and method...

Details Chip package substrate having soft circuit board and method... Chip package substrate having soft circuit board and method...

2006-07-11

2006-07-11

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S702000, C257S730000, C361S749000

Reexamination Certificate

active

07075176

ABSTRACT:
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.

REFERENCES:
patent: 5473119 (1995-12-01), Rosenmayer et al.
patent: 6815729 (2004-11-01), Brophy et al.
patent: 2002/0126460 (2002-09-01), Heismann et al.

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