LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

NANO IC packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Nanophotonic transceiver

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Nanotube based vapor chamber for die level cooling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Nanotube materials for thermal management of electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Nanotube modified solder thermal intermediate structure,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Narrow channel finned heat sinking for cooling high power electr

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Near hermetic packaging of gallium arsenide semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Nested integrated circuit package on package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Net-shape ceramic processing for electronic devices and packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Noise eliminating element and electrical circuit having the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Noise eliminating system on chip and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Noise resistant semiconductor power module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Non-contact data carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Non-contact data carrier and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Non-contact IC card and process for its production

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Non-contact IC card having insulated exposed leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Non-contact type IC card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Non-contact type IC card and process for manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Non-contact type IC card and process for manufacturing same