Chip package structure

Details Chip package structure Chip package structure

2011-07-19

2011-07-19

Tran, Tan N (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S690000, C257S691000, C257S693000, C257S698000, C257S706000, C257SE23010

Reexamination Certificate

active

07982304

ABSTRACT:
A chip package structure including a substrate, at least one chip, a heat dissipation device, at least one first conductive bar, a molding compound, and at least one second conductive bar is provided. The chip and the heat dissipation device are respectively disposed on a first and a second surface of the substrate. The first conductive bar has two opposite end surfaces, wherein one end surface is disposed on the first surface of the substrate, the other end surface is extended away from the substrate, and a fastening slot is disposed between the two end surfaces and passes through the other end surface. The molding compound encapsulates the substrate, the chip, part of the heat dissipation device, and the first conductive bar. The second conductive bar is disposed on one surface of the molding compound and has a protrusion portion fastened to the fastening slot of the first conductive bar.

REFERENCES:
patent: 6291880 (2001-09-01), Ogawa et al.
patent: 6844621 (2005-01-01), Morozumi et al.
patent: 9-129822 (1997-05-01), None
patent: 9-186269 (1997-07-01), None
patent: 10-022435 (1998-01-01), None
patent: 10-093015 (1998-04-01), None
patent: 10-135380 (1998-05-01), None

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