LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Back-to-back semiconductor device assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Backside exposure of desired nodes in a multi-layer integrated c

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball array layout

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball array layout in chip assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball assignment schemes for integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Ball grid array (BGA) semiconductor package improving solder...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array (BGA) semiconductor package member

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array copper balancing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Ball grid array housing having a cooling foil

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Ball grid array housing having a cooling foil

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Ball grid array integrated circuit package which employs a flip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array integrated circuit package with palladium...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Ball grid array integrated circuit package with thermal conducto

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package comprising a heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Ball grid array package construction with raised solder ball...