Wafer bonding of micro-electro mechanical systems to active...

Details Wafer bonding of micro-electro mechanical systems to active... Wafer bonding of micro-electro mechanical systems to active...

2007-04-10

2007-04-10

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S678000, C257SE21008, C257S499000

Reexamination Certificate

active

11012589

ABSTRACT:
A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS component on its first surface. The active device wafer has a first surface and includes an active device circuit on its first surface. The seal ring is adjacent the first surface of the MEMS wafer such that a seal is formed about the MEMS component. An external contact is provided on the wafer package. The external contact is accessible externally to the wafer package and is electrically coupled to the active device circuit of the active device wafer.

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