Wafer assembly comprising MEMS wafer with polymerized...

Details Wafer assembly comprising MEMS wafer with polymerized... Wafer assembly comprising MEMS wafer with polymerized...

2011-07-26

2011-07-26

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C029S890100

Reexamination Certificate

active

07986039

ABSTRACT:
A wafer assembly comprises a wafer having a MEMS layer formed on a frontside and a polymer coating covering the MEMS layer. A holding means is releasably attached to the polymer coating so that the wafer assembly facilitates performance of backside operations on a backside of the wafer. The polymer coating is comprised of a polymerized siloxane.

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