Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate
2011-07-26
2011-07-26
Coleman, W. David (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
C029S890100
Reexamination Certificate
active
07986039
ABSTRACT:
A wafer assembly comprises a wafer having a MEMS layer formed on a frontside and a polymer coating covering the MEMS layer. A holding means is releasably attached to the polymer coating so that the wafer assembly facilitates performance of backside operations on a backside of the wafer. The polymer coating is comprised of a polymerized siloxane.
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Bagnat Misty
Kerr Emma Rose
Lawlor Vincent Patrick
McAvoy Gregory John
Silverbrook Kia
Coleman W. David
Silverbrook Research Pty Ltd
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