LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal enhanced plastic ball grid array with heat sink...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal enhancement approach using solder compositions in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermal gap control

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermal grease insertion and retention

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal interconnect systems methods of production and uses...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal interconnect systems methods of production and uses...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal interconnect systems methods of production and uses...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermal interface attach mechanism for electrical packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal interface material design for enhanced thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermal interface material having carbon nanotubes and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal interface material with hotspot heat remover

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermal interface structure with integrated liquid cooling...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal interface thickness control for a microprocessor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermal interface with a patterned structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermal interface with non-tacky surface

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermal interposer for thermal management of semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermal interposer for thermal management of semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermal management enhancements for cavity packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermal management of electronic devices