Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1997-12-03
2000-03-28
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257712, 257704, 257709, 257730, 257731, 257699, 257719, 257729, 361783, 361767, H01L 2330, H01L 2328, H01L 2334
Patent
active
060435607
ABSTRACT:
A method and apparatus for controlling the thickness of a thermal interface between a processor die and a thermal plate in a microprocessor assembly are provided. The apparatus includes a generally rectangular shaped thermal top cover having a recessed portion of predetermined depth and aperture therein. The thermal top cover fits over the processor die. A thermal interface layer fills the recessed portion of the thermal top cover covering the processor die. The depth of the recessed portion is greater than the thickness of the processor die so that the thickness of the thermal interface layer is controlled. A thermal plate is placed over the thermal top cover in contact with the thermal grease so as to form a thermal path from the processor die to the thermal plate.
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Delaplane Niel C.
Gealer Charles A.
Haley Kevin J.
Krauskopf Joseph C.
Mahajan Ravindranath V.
Intel Corporation
Williams Alexander Oscar
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