Thermal interface attach mechanism for electrical packages

Details Thermal interface attach mechanism for electrical packages Thermal interface attach mechanism for electrical packages

1997-12-15

1999-10-12

Williams, Alexander Oscor

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257699, 257713, 257727, 257726, 257719, 257706, H05K 720, H01L 2316

Patent

active

059659378

ABSTRACT:
An electrical cartridge of the present invention includes a spring that pushes an integrated circuit package into a thermal plate. The integrated circuit package and substrate are attached to a substrate such as a printed circuit board. A cover may be attached to an opposite side of the substrate. There is typically a space between the integrated circuit package and the thermal plate that is filled with a thermal grease. The spring is located between the cover and the substrate in a manner which deflects the spring and exerts a force on the substrate. The spring force pushes the substrate and the integrated circuit package into the thermal plate. The spring may be designed to always provide a sufficient force to ensure a minimum space between the integrated circuit package and the thermal plate for assemblies produced in a mass production process.

REFERENCES:
patent: 4246597 (1981-01-01), Cole et al.
patent: 4686324 (1987-08-01), Debaisieux et al.
patent: 4805007 (1989-02-01), Schroeder
patent: 5005638 (1991-04-01), Goth et al.
patent: 5247425 (1993-09-01), Takahasi
patent: 5500556 (1996-03-01), Kosugi
patent: 5751062 (1998-05-01), Daikoku et al.
patent: 5801330 (1998-09-01), Gademann et al.

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