Thermal interconnect systems methods of production and uses...

Details Thermal interconnect systems methods of production and uses... Thermal interconnect systems methods of production and uses...

2007-08-14

2007-08-14

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S709000, C257S711000, C257S712000, C257S713000, C257S717000, C257S718000, C257S720000, C257S722000, C257SE33075, C438S122000

Reexamination Certificate

active

10538821

ABSTRACT:
A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.

REFERENCES:
patent: 2439935 (1948-04-01), Jones et al.
patent: 5223741 (1993-06-01), Bechtel et al.
patent: 5635764 (1997-06-01), Fujikawa et al.
patent: 5777385 (1998-07-01), Wu
patent: 5886403 (1999-03-01), Yoshinaga et al.
patent: 5981085 (1999-11-01), Ninomiya et al.
patent: 6274407 (2001-08-01), Baker et al.
patent: 6317326 (2001-11-01), Vogel et al.
patent: 6504242 (2003-01-01), Deppisch et al.
patent: 6617683 (2003-09-01), Lebonheur et al.
patent: 2002/0175403 (2002-11-01), Sreeram et al.
patent: 2003/0047814 (2003-03-01), Kwon
patent: 2000-294699 (2000-10-01), None
PCT International Search Report dated Dec. 12, 2004.
PCT Written Opinion dated Dec. 12, 2004.

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