Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-02-20
2007-02-20
Vu, Hung (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S675000, C257S706000
Reexamination Certificate
active
10872575
ABSTRACT:
A thermal interposer is provided for attachment to a surface of a semiconductor device. In one embodiment, the thermal interposer includes an upper plate having a bottom surface with a plurality of grooves and made of a material having high thermal conductivity, and a lower plate having a top surface with a plurality of grooves and made of a material having a coefficient of thermal expansion that is substantially the same as the coefficient of thermal expansion of the material of a semiconductor device that is bonded to the bottom surface of the lower plate. The bottom surface of the upper plate is hermetically bonded to the top surface of the lower plate so that a vapor chamber is formed by the upper and lower plates, and walls of the grooves on the top surface of the lower plate extend to within less than 250 microns from walls of the grooves on the bottom surface of the upper plate comprise a plurality of second walls the first walls.
REFERENCES:
patent: 3984861 (1976-10-01), Kessler, Jr.
patent: 4327399 (1982-04-01), Sasaki et al.
patent: 5769154 (1998-06-01), Adkins et al.
patent: 5947193 (1999-09-01), Adkins et al.
patent: 6056044 (2000-05-01), Benson et al.
patent: 6162659 (2000-12-01), Wu
patent: 6477045 (2002-11-01), Wang
patent: 6528878 (2003-03-01), Daikoku et al.
patent: 6566743 (2003-05-01), Zuo
patent: 6597575 (2003-07-01), Matayabas et al.
patent: 2002/0135980 (2002-09-01), Vafai
Colgan Evan G.
Lu Minhua
Mok Lawrence S.
Shih Da-Yuan
Bongini Stephen
Fleit Kain Gibbons Gutman Bongini & Bianco P. L.
International Business Machines - Corporation
Morris Daniel P.
Vu Hung
LandOfFree
Thermal interposer for thermal management of semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal interposer for thermal management of semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal interposer for thermal management of semiconductor... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3880046