Thermal interface structure with integrated liquid cooling...

Details Thermal interface structure with integrated liquid cooling... Thermal interface structure with integrated liquid cooling...

2006-04-18

2006-04-18

Fourson, George (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S706000, C257S714000, C257S717000

Reexamination Certificate

active

07030485

ABSTRACT:
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further shown that require simple, low numbers of manufacturing steps and reduced thermal interface thickness.

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