Thermal interface material design for enhanced thermal...

Details Thermal interface material design for enhanced thermal... Thermal interface material design for enhanced thermal...

2011-06-07

2011-06-07

Tran, Long K (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000, C257S717000, C257S720000, C257SE33076, C257SE31131, C257SE23051, C257SE23098, C257SE23101

Reexamination Certificate

active

07956456

ABSTRACT:
An electronic package comprising a semiconductor device, a heat spreader layer, and a thermal interface material layer located between the semiconductor device and the heat spreader layer. The thermal interface material layer includes a resin layer having heat conductive particles suspended therein. A portion of the particles are exposed on at least one non-planar surface of the resin layer such that the portion of exposed particles occupies a majority of a total area of a horizontal plane of the non-planar surface.

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patent: 2008/0124841 (2008-05-01), Too et al.
patent: 2008/0274349 (2008-11-01), Chiu et al.
patent: 2009/0166852 (2009-07-01), Hu

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