Thermal enhanced plastic ball grid array with heat sink...

Details Thermal enhanced plastic ball grid array with heat sink... Thermal enhanced plastic ball grid array with heat sink...

2008-02-28

2008-10-07

Schillinger, Laura M (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000, C257S707000

Reexamination Certificate

active

07432591

ABSTRACT:
A thermal enhanced structure comprising a packaged electronic device and a heat sink that is removably attached thereto. The thermal enhanced structure includes a plastic ball grid array (PGBA) with an electronic chip, a plastic mold cover, and a heat spreader with a plurality of spaced apart securing studs positioned and caulked at a periphery edge thereof. The mold cover, the heat spreader and studs are molded and embedded with one another to form a single unit with improved torque strength and heat dissipation. The single molded unit and the plastic ball grid array are secured together by an adhesive material. Then the heat sink can be easily and removably attached to the molded single unit by fastening elements to the molded studs, thereby allowing more efficient controllable forces or pressures to be applied as the mechanical fastening elements are removably attached to the molded studs to thereby prevent stress and damage to the PBGA package.

REFERENCES:
patent: 5969950 (1999-10-01), Tantoush
patent: 6219238 (2001-04-01), Andros et al.
patent: 6483708 (2002-11-01), Ali et al.
patent: 6751099 (2004-06-01), Vrtis et al.
patent: 6756669 (2004-06-01), Houle et al.
patent: 6879039 (2005-04-01), Khan et al.
patent: 6882535 (2005-04-01), Labanok et al.
patent: 6906414 (2005-06-01), Zhao et al.
patent: 6989593 (2006-01-01), Khan et al.
patent: 7005737 (2006-02-01), Zhao et al.
patent: 7038312 (2006-05-01), Khan et al.
patent: 7102225 (2006-09-01), Khan et al.
patent: 7132744 (2006-11-01), Zhao et al.
patent: 7161239 (2007-01-01), Zhao et al.
patent: 7170165 (2007-01-01), Berto et al.
patent: 7202559 (2007-04-01), Zhao et al.
patent: 7219421 (2007-05-01), Vrtis et al.
patent: 7227256 (2007-06-01), Zhao et al.
patent: 2002/0079562 (2002-06-01), Zhao et al.
patent: 2002/0079572 (2002-06-01), Khan et al.
patent: 2002/0185720 (2002-12-01), Khan et al.
patent: 2002/0185722 (2002-12-01), Zhao et al.
patent: 2002/0185734 (2002-12-01), Zhao et al.
patent: 2002/0185750 (2002-12-01), Khan et al.
patent: 2002/0190361 (2002-12-01), Zhao et al.
patent: 2002/0190362 (2002-12-01), Khan et al.
patent: 2003/0057550 (2003-03-01), Zhao et al.
patent: 2003/0111726 (2003-06-01), Khan et al.
patent: 2004/0212051 (2004-10-01), Zhao et al.
patent: 2005/0029657 (2005-02-01), Khan et al.
patent: 2005/0127501 (2005-06-01), Khan et al.
patent: 2005/0133905 (2005-06-01), Zhao et al.
patent: 2005/0139994 (2005-06-01), Hsu et al.
patent: 2006/0065972 (2006-03-01), Khan et al.
patent: 2006/0145316 (2006-07-01), Kim et al.
patent: 2007/0007644 (2007-01-01), Zhao et al.
patent: 2007/0045824 (2007-03-01), Zhao et al.

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