Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
1999-09-30
2002-10-29
Jackson, Jerome (Department: 2827)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000
Reexamination Certificate
active
06472742
ABSTRACT:
BACKGROUND
To prevent microprocessors and other heat generating electronic components from overheating, excess heat is sometimes conducted to a heat sink where it is dissipated. The heat sink may be mounted above the microprocessor with a thermally conductive elastomer held in a thermal gap between the heat sink and the microprocessor. The elastomer is held in compression between the heat sink and the microprocessor to provide a good thermal conduction path that will last for a long period.
In such an approach, the distance between the upper surface of the printed circuit board and the upper surface of the microprocessor package may vary from unit-to-unit because of manufacturing tolerances. The spring device provides enough free play to accommodate such changes.
SUMMARY
In implementations of the invention, a heat dissipating element (e.g., a heat sink) is held in an initial position closer to a heat generating structure (e.g., a microprocessor) and in a subsequent position farther from the heat generating structure. A thermal interface material (e.g., a thermal grease) spans the gap, but is not held under compression, between the heat sink and the microprocessor.
Because no compression is applied to the thermal interface material, soft materials that have little or no strength to resist compressive forces may be used as the thermal interface. The thermally conductive path remains good over a long period. Variations in the thermal gap are accommodated without imposing a compressive force on the thermal interface material. Tight control over the size of the thermal gap is maintained.
Other advantages and features will become apparent from the following description and from the claims.
REFERENCES:
patent: 5926371 (1999-07-01), Dolbear
patent: 5959838 (1999-09-01), Liang
patent: 5960862 (1999-10-01), Hu
patent: 5963428 (1999-10-01), Salmonson et al.
patent: 5969947 (1999-10-01), Johnson et al.
patent: 5978223 (1999-11-01), Hamilton et al.
patent: 5985697 (1999-11-01), Chaney et al.
patent: 5990552 (1999-11-01), Xiet et al.
patent: 6229702 (2001-05-01), Tao et al.
patent: 6249440 (2001-06-01), Affolter
Bhatia Rakesh
James Gregory A.
Cruz Lourdes
Fish & Richardson P.C.
Jackson Jerome
LandOfFree
Thermal gap control does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal gap control, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal gap control will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2921880