Thermal enhance package with universal heat spreader

Details Thermal enhance package with universal heat spreader Thermal enhance package with universal heat spreader

2007-05-29

2007-05-29

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S675000, C257S704000, C257S705000, C257S706000, C257S718000, C257S719000, C257S720000, C257S721000, C257S722000, C257S796000, C438S122000

Reexamination Certificate

active

10657132

ABSTRACT:
A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically connected to the carrier in a flip-chip fashion and the universal heat spreader is mounted on the back surface of the semiconductor chip. Therein the universal heat spreader has a plurality of through holes for upgrading the efficiency of heat transmission. Moreover, a heat transmission pin is provided in one of the through holes to increase the areas for heat dissipation so as to enhance the thermal performance of the package.

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