Thermal management enhancements for cavity packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

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Details

257687, 257707, H01L 2342

Patent

active

060810289

ABSTRACT:
A thermal conducting material for providing lateral thermal conduction across a surface of an integrated circuit and for enhancing thermal dissipation from the integrated circuit. The integrated circuit is incorporated within a semiconductor device having a cavity package. A layer of the thermal conducting material, preferably electrically non-conductive, is disposed on a surface of an integrated circuit in the form of a die to provide lateral heat conduction to reduce the number of hot spots within the integrated circuit. Alternatively, the thermal conducting, electrically non-conductive material may be used to fill a cavity within the cavity package so that the cavity package dissipates heat in a more effective manner.

REFERENCES:
patent: 4000509 (1976-12-01), Jurvela
patent: 4641176 (1987-02-01), Keryhuel et al.
patent: 4763407 (1988-08-01), Abe
patent: 4812897 (1989-03-01), Narita et al.
patent: 4819041 (1989-04-01), Redmond
patent: 4876588 (1989-10-01), Miyamoto
patent: 4887148 (1989-12-01), Mu
patent: 4901137 (1990-02-01), Sato et al.
patent: 4914551 (1990-04-01), Anschel et al.
patent: 4965660 (1990-10-01), Ogihara et al.
patent: 5175613 (1992-12-01), Barker, III et al.
patent: 5184211 (1993-02-01), Fox
patent: 5216283 (1993-06-01), Lin
patent: 5455457 (1995-10-01), Kurokawa

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