Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-02-21
2006-02-21
Zarabian, Amir (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S625000, C257S658000, C257S675000, C257S705000, C257S706000, C257S712000, C257S720000, C257S773000, C257S798000, C257S717000
Reexamination Certificate
active
07002247
ABSTRACT:
A thermal interposer is provided for attachment to the back surface of a semiconductor device so as to give a very low thermal resistance. In one preferred embodiment, the thermal interposer has two plates containing wick structures such as grooves. The thermal interposer is integrated with a semiconductor device so as to form a vapor chamber. In particular, the back surface of the semiconductor chip is in direct contact with the interior sealed volume of the vapor chamber, so as to greatly reduce the thermal resistance from the combination of the chip and the vapor chamber. Further, the upper plate is thermally coupled to a heat-sinking fixture such as a heat sink or a cold plate.
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Colgan Evan G.
Lu Minhua
Mok Lawrence S.
Shih Da-Yuan
Bongini Stephen
Fleit Kain Gibbons Gutman Bongini & Bianco P.L.
Soward Ida M.
Zarabian Amir
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