Thermal interface with non-tacky surface

Details Thermal interface with non-tacky surface Thermal interface with non-tacky surface

2007-12-26

2011-12-13

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C165S185000, C361S705000, C438S584000, C438S122000, C257SE23080, C257SE21090, C257SE21499

Reexamination Certificate

active

08076773

ABSTRACT:
A thermal interface member includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.

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