Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-02-28
2009-12-08
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000, C257S723000, C257S774000, C257SE23145, C257S701000
Reexamination Certificate
active
07629683
ABSTRACT:
Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias.
REFERENCES:
patent: 4535385 (1985-08-01), August et al.
patent: 5475264 (1995-12-01), Sudo et al.
patent: 6069793 (2000-05-01), Maruyama et al.
patent: 6201300 (2001-03-01), Tseng et al.
patent: 6377464 (2002-04-01), Hashemi et al.
patent: 6671176 (2003-12-01), Barcley
patent: 6770967 (2004-08-01), Barcley
patent: 6794747 (2004-09-01), Takehara et al.
patent: 7148554 (2006-12-01), Nah et al.
patent: 7405474 (2008-07-01), Brophy
patent: 2003/0020173 (2003-01-01), Huff et al.
patent: 2005/0133929 (2005-06-01), Howard
patent: 2005/0254215 (2005-11-01), Khbeis et al.
patent: 0 600 590 (1994-06-01), None
patent: 0 871 352 (1998-10-01), None
European Search Report corresponding to EP 07 25 0789, dated Apr. 17, 2009, 6 pages.
Harrity & Harrity LLP
Juniper Networks, Inc.
Parekh Nitin
LandOfFree
Thermal management of electronic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal management of electronic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal management of electronic devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4071466