LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Embedded heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Embedded heat spreader ball grid array

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Embedded integrated circuit package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Embedded integrated circuit package system and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Embedded leadframe semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Embedded memory assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Embedded substrate for integrated circuit modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Embedded thermal conductors for semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Embedded type multifunctional integrated structure for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Embedded type package of power semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Embedded wiring board, semiconductor package including the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

EMI grounding pins for CPU/ASIC chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

EMI heatspreader/lid for integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Employing on die temperature sensors and fan-heatsink failure si

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Enbedded memory assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Encapsulant dam standoff for shell-enclosed die assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Encapsulants for protecting MEMS devices during...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Encapsulated component and method for the production thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Encapsulated electronic part packaging structure