Encapsulants for protecting MEMS devices during...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

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C257S690000, C257S778000, C257S784000, C257S787000

Reexamination Certificate

active

06956283

ABSTRACT:
The present invention relates to methods to protect a MEMS or microsensor device through one or more release or activation steps in a “package first, release later” manufacturing scheme: This method of fabrication permits wirebonds, other interconnects, packaging materials, lines, bond pads, and other structures on the die to be protected from physical, chemical, or electrical damage during the release etch(es) or other packaging steps. Metallic structures (e.g., gold, aluminum, copper) on the device are also protected from galvanic attack because they are protected from contact with HF or HCL-bearing solutions.

REFERENCES:
patent: 5061657 (1991-10-01), Queen et al.
patent: 5587090 (1996-12-01), Belcher et al.
patent: 5622898 (1997-04-01), Zechman
patent: 6238580 (2001-05-01), Cole et al.
patent: 6274514 (2001-08-01), Jang et al.
patent: 6303977 (2001-10-01), Schroen et al.
patent: 6455927 (2002-09-01), Glenn et al.
patent: 6472739 (2002-10-01), Wood et al.
patent: 6511859 (2003-01-01), Jiang et al.
Cole, Robertson, Swenson, & Osborn, “MEMS Packaging Technique Using HF Vapor Release”, ICAPS Meeting Mar., 2002.

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