EMI grounding pins for CPU/ASIC chips

Details EMI grounding pins for CPU/ASIC chips EMI grounding pins for CPU/ASIC chips

2005-10-18

2005-10-18

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S660000, C257S704000, C257S707000, C257S713000, C257S778000, C257S659000

Reexamination Certificate

active

06956285

ABSTRACT:
An integrated circuit package includes EMI containment features. The EMI containment features may include a plurality of pins on a substrate of the integrated circuit package. The pins may be a peripheral row of pins in an array of pins. The pins may couple a lid of the package to at least one ground plane of a circuit board.

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