Embedded integrated circuit package system and method of...

Details Embedded integrated circuit package system and method of... Embedded integrated circuit package system and method of...

2010-12-09

2011-11-29

Dang, Trung Q (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S778000, C257SE23116, C438S108000, C438S126000

Reexamination Certificate

active

08067832

ABSTRACT:
A method of manufacture of an embedded integrated circuit package system includes: forming a first conductive pattern on a first structure; connecting a first integrated circuit die, having bumps on a first active side, directly on the first conductive pattern by the bumps; forming a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern; forming a channel in the substrate forming encapsulation; and applying a conductive material in the channel.

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