Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-02-27
2007-02-27
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S685000, C257S777000, C257S678000, C438S108000, C438S109000, C361S760000
Reexamination Certificate
active
11027291
ABSTRACT:
An embedded heat spreader includes a semiconductor die, an elastomer layer attached to the die, a tape lead attached to the elastomer, a portion of the tape lead exposed through the elastomer to connect with the die, a polymer resin attached to the tape lead, and a thermally conductive substrate attached to the polymer resin such that the thermally conductive substrate can spread heat from the semiconductor die.
REFERENCES:
patent: 3574818 (1971-04-01), Takehara et al.
patent: 4547570 (1985-10-01), Garner
patent: 4650716 (1987-03-01), Gelman
patent: 4689408 (1987-08-01), Gelman et al.
patent: 4975761 (1990-12-01), Chu
patent: 5763939 (1998-06-01), Yamashita
patent: 5861666 (1999-01-01), Bellaar
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6093969 (2000-07-01), Lin
patent: 6122171 (2000-09-01), Akram et al.
patent: 6130477 (2000-10-01), Chen et al.
patent: 6188127 (2001-02-01), Senba et al.
patent: 6218731 (2001-04-01), Huang et al.
patent: 6278616 (2001-08-01), Gelsomini et al.
patent: 6380620 (2002-04-01), Suminoe et al.
patent: 6420782 (2002-07-01), Eng et al.
patent: 6472727 (2002-10-01), Miyazaki et al.
patent: 6493229 (2002-12-01), Akram et al.
patent: 6538895 (2003-03-01), Worz et al.
patent: 6577013 (2003-06-01), Glenn et al.
patent: 6593468 (2003-07-01), Lange et al.
patent: 6646334 (2003-11-01), Hur
patent: 6664649 (2003-12-01), Huang
patent: 6765042 (2004-07-01), Thornton et al.
patent: 6897565 (2005-05-01), Pflughaupt et al.
patent: 2003/0174478 (2003-09-01), Stefano et al.
patent: 11145345 (1999-05-01), None
patent: WO 03/019654 (2003-03-01), None
Barbucci R et al., Swelling behavior of carboxymethylcellulose hydrogels in relation to cross-inking, pH and charge density,Macromol 33: 7475-7480 (2000).
Heinze et al., “Studies on the synethsus and characterization of carboxymethylcellulose,”Die Ang Makro Chem 266: 37-45 (1999).
Kalman et al., “Effect of the reaction conditions on the degree of substitution of carboxymethyl cellulose,”Colloid Polym Sci 266: 716-720 (1999).
Klemm et al., Etherization of Cellulose, “Comprehensive Cellulose Cehmistry, vol. 2: Functionalization of Cellulose,”and Appendix, p. 353, Wiley-VCH (2001).
Zhang et al, “Solvent effect on carboxymethylation of cellulose,”J Appl Poly Sci 49: 741-746 (1993).
English language abstract of Japanese Publication No. 11145345, vol. 1999, No. 10 (Aug. 31, 1999).
Chu Chris C.
Marger & Johnson & McCollom, P.C.
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