Embedded wiring board, semiconductor package including the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

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Details

C257S686000, C257S700000, C257S701000, C257S764000, C257SE25029

Reexamination Certificate

active

08039939

ABSTRACT:
Provided are an embedded wiring board and a method of manufacturing the same. The embedded wiring board includes: a printed circuit board (PCB) including a first surface and a second surface, the first surface having a concave portion; through electrodes penetrating the PCB; a semiconductor device group embedded in the concave portion of the PCB, the semiconductor device group including bonding pads exposed in a direction of the first surface of the PCB; bumps disposed on the bonding pads, exposed in the direction of the first surface of the PCB; and a film substrate including a first surface and a second surface, the first surface including connection electrode patterns that are electrically connected to the bumps and the through electrodes, the film substrate having penetrated openings.

REFERENCES:
patent: 2890395 (1959-06-01), Lathrop et al.
patent: 7217994 (2007-05-01), Zhu et al.
patent: 2001/0028114 (2001-10-01), Hosomi
patent: 03-283591 (1991-12-01), None
patent: 08-204056 (1996-08-01), None
patent: 09-321408 (1997-12-01), None
patent: 2002-246757 (2002-08-01), None
patent: 100685177 (2007-02-01), None
patent: 1020070029930 (2007-03-01), None
patent: WO 2004/077902 (2004-09-01), None
patent: WO 2004/077903 (2004-09-01), None

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