Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate
2009-06-30
2011-10-18
Smith, Bradley K (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
C257S686000, C257S700000, C257S701000, C257S764000, C257SE25029
Reexamination Certificate
active
08039939
ABSTRACT:
Provided are an embedded wiring board and a method of manufacturing the same. The embedded wiring board includes: a printed circuit board (PCB) including a first surface and a second surface, the first surface having a concave portion; through electrodes penetrating the PCB; a semiconductor device group embedded in the concave portion of the PCB, the semiconductor device group including bonding pads exposed in a direction of the first surface of the PCB; bumps disposed on the bonding pads, exposed in the direction of the first surface of the PCB; and a film substrate including a first surface and a second surface, the first surface including connection electrode patterns that are electrically connected to the bumps and the through electrodes, the film substrate having penetrated openings.
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Karimy Mohammad
Myers Bigel Sibley & Sajovec P.A.
Samsung Electronics Co,. Ltd.
Smith Bradley K
LandOfFree
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