Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-10-24
2006-10-24
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S707000, C257S691000, C257S787000, C257S718000, C257S778000, C257S796000
Reexamination Certificate
active
07126218
ABSTRACT:
A heat slug or spreader is attached directly to a surface of the die in a ball grid array (BGA) package. The heat spreader roughly conforms to the topological profile of the die, underlying substrate, and electrical interconnections between the die and the substrate, such as bond wires. The outer portion of the heat spreader substantially cover the outer portion of the substrate, or alternatively, cover only those portions extending in laterally from the sides of the chip and not the corners. An encapsulant completely covers the heat spreader and die.
REFERENCES:
patent: 5041902 (1991-08-01), McShane
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5200809 (1993-04-01), Kwon
patent: 5328870 (1994-07-01), Marrs
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5365107 (1994-11-01), Kuraishi et al.
patent: 5381042 (1995-01-01), Lerner et al.
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5455462 (1995-10-01), Marrs
patent: 5471011 (1995-11-01), Maslakow
patent: 5478007 (1995-12-01), Marrs
patent: 5482898 (1996-01-01), Marrs
patent: 5485037 (1996-01-01), Marrs
patent: 5530202 (1996-06-01), Dais et al.
patent: 5566051 (1996-10-01), Burns
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5616957 (1997-04-01), Kajihara
patent: 5629561 (1997-05-01), Shin et al.
patent: 5650663 (1997-07-01), Parthasarathi
patent: 5656864 (1997-08-01), Mitsue et al.
patent: 5739581 (1998-04-01), Chillara et al.
patent: 5783860 (1998-07-01), Jeng et al.
patent: 5854511 (1998-12-01), Shin et al.
patent: 5929513 (1999-07-01), Asano et al.
patent: 5929514 (1999-07-01), Yalamanchili
patent: 5977626 (1999-11-01), Wang et al.
patent: 6008991 (1999-12-01), Hawthorne et al.
patent: 6028354 (2000-02-01), Hoffman
patent: 6069023 (2000-05-01), Bernier et al.
patent: 6093960 (2000-07-01), Tao et al.
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6166446 (2000-12-01), Masaki
patent: 6198163 (2001-03-01), Crowley et al.
patent: 6229702 (2001-05-01), Tao et al.
patent: 6246115 (2001-06-01), Tang et al.
patent: 6258629 (2001-07-01), Niones et al.
patent: 6262480 (2001-07-01), Ferri et al.
patent: 6326696 (2001-12-01), Horton et al.
patent: 6400014 (2002-06-01), Huang et al.
patent: 6429512 (2002-08-01), Huang et al.
patent: 6853070 (2005-02-01), Khan et al.
patent: 2002/0109226 (2002-08-01), Khan et al.
patent: 2002/0171144 (2002-11-01), Zhang et al.
patent: 60182731 (1985-09-01), None
patent: 63128736 (1988-06-01), None
Darveaux Robert F.
DiCaprio Vincent
Guenin Bruce M.
Hamilton Frederick J. G.
Amkor Technology Inc.
Erdem Fazli
Flynn Nathan J.
Gunnison McKay & Hodgson, L.L.P.
Hodgson Serge J.
LandOfFree
Embedded heat spreader ball grid array does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Embedded heat spreader ball grid array, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Embedded heat spreader ball grid array will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3684410