Embedded die package on package (POP) with pre-molded leadframe

Details Embedded die package on package (POP) with pre-molded leadframe Embedded die package on package (POP) with pre-molded leadframe

2008-02-06

2011-11-22

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE25018, C257S685000, C257S777000, C438S109000, C361S760000

Reexamination Certificate

active

08063474

ABSTRACT:
A multiple-chip package has top and bottom pre-molded leadframes formed prior to the flip-chip attachment of semiconductor die to the leadframes. After die attachment, underfill is used to encase all but one surface of the die, and the top and bottom leadframes are joined together by solder bump balls with the exposed surfaces of the semiconductor dice proximate to each other.

REFERENCES:
patent: 5656856 (1997-08-01), Kweon
patent: 5770888 (1998-06-01), Song et al.
patent: 6093969 (2000-07-01), Lin
patent: 6403398 (2002-06-01), Ohuchi et al.
patent: 6413798 (2002-07-01), Asada
patent: 6486545 (2002-11-01), Glenn et al.
patent: 6774467 (2004-08-01), Horiuchi et al.
patent: 6836007 (2004-12-01), Michii et al.
patent: 7049684 (2006-05-01), Minamio et al.
patent: 7129116 (2006-10-01), Islam et al.
patent: 7205647 (2007-04-01), Karnezos
patent: 7242081 (2007-07-01), Lee
patent: 7259451 (2007-08-01), Seng et al.
patent: 7262494 (2007-08-01), Shiu et al.
patent: 7274088 (2007-09-01), Wu et al.
patent: 7378297 (2008-05-01), Beyne
patent: 7425755 (2008-09-01), Liu
patent: 7495319 (2009-02-01), Fukuda et al.
patent: 7563647 (2009-07-01), Bathan et al.
patent: 7576995 (2009-08-01), Thomas et al.
patent: 7618846 (2009-11-01), Pagaila et al.
patent: 2003/0038347 (2003-02-01), Chiu et al.
patent: 2003/0197290 (2003-10-01), Crowley et al.
patent: 2006/0006534 (2006-01-01), Yean et al.
patent: 2006/0175688 (2006-08-01), Jang
patent: 2007/0013038 (2007-01-01), Yang
patent: 2007/0108560 (2007-05-01), Tang et al.

Affiliated with

Also associated with

Rating

Embedded die package on package (POP) with pre-molded leadframe does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Embedded die package on package (POP) with pre-molded leadframe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Embedded die package on package (POP) with pre-molded leadframe will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4286313