Embedded integrated circuit package system

Details Embedded integrated circuit package system Embedded integrated circuit package system

2006-04-19

2010-12-28

Dang, Trung (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S778000, C438S108000, C438S126000

Reexamination Certificate

active

07859098

ABSTRACT:
An embedded integrated circuit package system is provided forming a first conductive pattern on a first structure, connecting a first integrated circuit die on the first conductive pattern, forming a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern, forming a channel in the substrate forming encapsulation, and applying a conductive material in the channel.

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