Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1998-08-31
2000-12-12
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257724, 257666, 438111, 438107, H01L 2334
Patent
active
061603120
ABSTRACT:
Memory devices, such as random access memory, are affixed to an electrical contact frame and coupled to signals lines on the contact frame which is, in turn, mounted on a top surface of an integrated circuit. The signal leads are coupled to electrical contact pads disposed on the top surface of the integrated circuit. The contact pads and signal leads transfer control and power signals between the integrated circuit and the memory devices.
REFERENCES:
patent: 4774630 (1988-09-01), Reisman et al.
patent: 5222014 (1993-06-01), Lin
patent: 5237434 (1993-08-01), Feldman et al.
patent: 5266912 (1993-11-01), Kledzik
patent: 5454160 (1995-10-01), Nickel
patent: 5491612 (1996-02-01), Nicewarner, Jr,
patent: 5559305 (1996-09-01), Lee et al.
patent: 5565706 (1996-10-01), Miura et al.
patent: 5568574 (1996-10-01), Tanquay, Jr. et al.
patent: 5652462 (1997-07-01), Matsunaga et al.
patent: 5677567 (1997-10-01), Ma
patent: 5801433 (1998-09-01), Nakao et al.
patent: 5869895 (1999-02-01), Raad
patent: 5907166 (1999-05-01), Casper et al.
patent: 6043557 (2000-03-01), Phelps, Jr. et al.
Clark Sheila V.
Micro)n Technology, Inc.
LandOfFree
Enbedded memory assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Enbedded memory assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enbedded memory assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-220819