EMI heatspreader/lid for integrated circuit packages

Details EMI heatspreader/lid for integrated circuit packages EMI heatspreader/lid for integrated circuit packages

2005-09-13

2005-09-13

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S675000, C257S688000, C257S689000, C257S660000, C257S659000, C257S728000, C257S706000, C257S707000, C257S713000, C257S789000, C257S691000, C257S758000, C257S701000, C257S700000, C257S738000, C257S690000, C257S777000, C257S737000

Reexamination Certificate

active

06943436

ABSTRACT:
An integrated circuit package includes a lid with EMI containment features. The lid may include a plurality of projections adapted to couple a ground plane of a circuit board.

REFERENCES:
patent: 4082394 (1978-04-01), Gedney et al.
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5357404 (1994-10-01), Bright et al.
patent: 5490040 (1996-02-01), Gaudenzi et al.
patent: 5561265 (1996-10-01), Livshits et al.
patent: 5566052 (1996-10-01), Hughes
patent: 5639989 (1997-06-01), Higgins, III
patent: 5703397 (1997-12-01), Endo et al.
patent: 5745344 (1998-04-01), Baska et al.
patent: 5748455 (1998-05-01), Phillips et al.
patent: 5753857 (1998-05-01), Choi
patent: 5804872 (1998-09-01), Miyano et al.
patent: 5825634 (1998-10-01), Moorehead, Jr.
patent: 6008536 (1999-12-01), Mertol
patent: 6057600 (2000-05-01), Kitazawa et al.
patent: 6063999 (2000-05-01), Kelly
patent: 6088231 (2000-07-01), Fajardo
patent: 6137051 (2000-10-01), Bundza
patent: 6140577 (2000-10-01), Rapaich et al.
patent: 6198630 (2001-03-01), Cromwell
patent: 6219239 (2001-04-01), Mellberg et al.
patent: 6239359 (2001-05-01), Lilienthal et al.
patent: 6252313 (2001-06-01), Zhang et al.
patent: 6259609 (2001-07-01), Kurz
patent: 6269863 (2001-08-01), Wyler
patent: 6278617 (2001-08-01), Yang et al.
patent: 6288330 (2001-09-01), Chen
patent: 6324074 (2001-11-01), Lunden
patent: 6362477 (2002-03-01), Sowerby et al.
patent: 6400164 (2002-06-01), Sampath
patent: 6455925 (2002-09-01), Laurenti
patent: 6483406 (2002-11-01), Sawa et al.
patent: 6515870 (2003-02-01), Skinner et al.
patent: 6518660 (2003-02-01), Kwon et al.
patent: 6573590 (2003-06-01), Radu et al.
patent: 6597575 (2003-07-01), Matayabas et al.
patent: 6683796 (2004-01-01), Radu et al.
patent: 6703704 (2004-03-01), Alcoe et al.

Affiliated with

Also associated with

Rating

EMI heatspreader/lid for integrated circuit packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with EMI heatspreader/lid for integrated circuit packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and EMI heatspreader/lid for integrated circuit packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3405752