Embedded leadframe semiconductor package

Details Embedded leadframe semiconductor package Embedded leadframe semiconductor package

2007-03-13

2007-03-13

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C438S109000, C257S713000, C257S666000

Reexamination Certificate

active

10868244

ABSTRACT:
A semiconductor package comprising a substrate having opposed top and bottom surfaces and a conductive pattern formed thereon. Disposed on the top surface of the substrate is a semiconductor die which is electrically connected to the conductive pattern. Also disposed on the top surface of the substrate is a leadframe which is electrically connected to the conductive pattern as well. A package body encapsulates the semiconductor die and partially encapsulates the leadframe such that a portion of the leadframe is exposed in one exterior surface of the package body, thus allowing a second semiconductor package to be stacked upon and electrically connected to the semiconductor package.

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