Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-01-09
2010-06-22
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S659000, C257S688000, C257S691000, C257S698000
Reexamination Certificate
active
07741709
ABSTRACT:
An embedded type multifunctional integrated structure for integrating protection components and a method for manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrate more than two passive components on a component structure that is adhered onto a substrate and is applied to a USB terminal in order to protect an electronic device that uses the USB. Hence, the present invention has an OCP function, an OVP function, and an anti-ESD function at the same time. Therefore, the present invention effectively integrates two or more passive components in order to increase functionality. Moreover, the present invention effectively reduces the size of the passive components on a PCB and reduces the number of solder joints.
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Huang Chien-Hao
Li Wen-Chih
Andújar Leonardo
Arroyo Teresa M.
Inpaq Technology Co. Ltd.
Rosenberg , Klein & Lee
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