Encapsulated electronic part packaging structure

Details Encapsulated electronic part packaging structure Encapsulated electronic part packaging structure

2006-11-07

2008-08-19

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S758000, C257S774000, C257SE23008, C257SE23019, C257SE23169, C438S622000

Reexamination Certificate

active

07414309

ABSTRACT:
An encapsulated electronic part packaging structure includes a step of mounting an electronic part having a connection terminal and a passivating film to cover the connection terminal, mounted on a body to direct the connection terminal upward. An insulating layer is formed to cover the electronic part, and a via hole is formed in a portion of the passivating film and the insulating layer on the connection terminal to expose the connection terminal. A wiring pattern, which is connected electrically to the connection terminal via the via hole, is formed on the insulating layer.

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patent: 2006/0065980 (2006-03-01), Yabuki
patent: 03156905 (1991-07-01), None
patent: 2000-323645 (2000-11-01), None

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