Conversion of transition metal to silicide through back end...
Convex device with selectively doped channel
Copper process compatible CMOS metal-insulator-metal...
Core cell structure and corresponding process for NAND type...
Corner clipping for field effect devices
Corner rounding in a replacement gate approach based on a...
Corner rounding process for partial vertical transistor
Corrugated post capacitor and method of fabricating using select
Coupling well structure for improving HVMOS performance
Covered slit isolation between integrated circuit devices
Creating high voltage FETs with low voltage process
Creating shallow junction transistors
Creation of a self-aligned, ion implanted channel region, after
Cross leakage of capacitors in DRAM or embedded DRAM
Crown capacitor using a tapered etch of a damascene lower electr
CU second electrode process with in situ ashing and...
Current controlled field effect transistor
Current limiting circuit with continuous metallization
Current source bias circuit with hot carrier injection tracking
CVD Ta2O5/oxynitride stacked gate insulator with TiN gate...