Conversion of transition metal to silicide through back end...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S301000, C438S655000, C438S664000

Reexamination Certificate

active

07151020

ABSTRACT:
A method of forming an integrated circuit with a semiconductor substrate is provided. A gate dielectric is formed on the semiconductor substrate, and a gate is formed on the gate dielectric. Source/drain junctions are formed in the semiconductor substrate. A transition metal layer is formed on the source/drain junctions and on the gate. An interlayer dielectric is formed above the semiconductor substrate. Contacts are then formed in the interlayer dielectric, whereby a silicide is formed from the transition metal layer at a temperature no higher than the maximum temperature at which the interlayer dielectric and the contacts are formed.

REFERENCES:
patent: 5728625 (1998-03-01), Tung
patent: 5741725 (1998-04-01), Inoue et al.
patent: 6117689 (2000-09-01), Summerfelt
patent: 6455420 (2002-09-01), Suenaga
patent: 2004/0061184 (2004-04-01), Lu et al.
patent: 2004/0256645 (2004-12-01), Tsuchiaki et al.

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