Active wafer cooling during damage engineering implant to...

Adhesion enhancement for metal/dielectric interface

Adhesion improvement for low k dielectrics

Adhesion improvement for low k dielectrics

Adhesion to copper and copper electromigration resistance

Adhesive support method for wafer coating, thinning and...

Adjustment of N and K values in a DARC film

Advanced low dielectric constant organosilicon plasma...

Advanced multilayer dielectric cap with improved mechanical...

Aerosol misted deposition of low dielectric organosilicate...

Aggregate dielectric layer to reduce nitride consumption

ALD metal oxide deposition process using direct oxidation

ALD metal oxide deposition process using direct oxidation

ALD metal oxide deposition process using direct oxidation

ALD of amorphous lanthanide doped TiO x films

ALD of amorphous lanthanide doped TiO x films

ALD of metal silicate films

Aluminum phosphate incorporation in silica thin films...

Ambient gas treatment of porous dielectric

Anisotropic formation process of oxide layers for vertical...