Active wafer cooling during damage engineering implant to...
Adhesion enhancement for metal/dielectric interface
Adhesion improvement for low k dielectrics
Adhesion improvement for low k dielectrics
Adhesion to copper and copper electromigration resistance
Adhesive support method for wafer coating, thinning and...
Adjustment of N and K values in a DARC film
Advanced low dielectric constant organosilicon plasma...
Advanced multilayer dielectric cap with improved mechanical...
Aerosol misted deposition of low dielectric organosilicate...
Aggregate dielectric layer to reduce nitride consumption
ALD metal oxide deposition process using direct oxidation
ALD metal oxide deposition process using direct oxidation
ALD metal oxide deposition process using direct oxidation
ALD of amorphous lanthanide doped TiO x films
ALD of amorphous lanthanide doped TiO x films
ALD of metal silicate films
Aluminum phosphate incorporation in silica thin films...
Ambient gas treatment of porous dielectric
Anisotropic formation process of oxide layers for vertical...